ST33TPHF2ESPI datasheet(13/26 Pages) STMICROELECTRONICS

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ST33TPHF2ESPI Arkusz danych(PDF) 13 Page - STMicroelectronics

Numer części	ST33TPHF2ESPI

Szczegółowy opis	Flash-memory-based device combining TPM 1.2 and TPM 2.0 with an SPI interface

PDF	26 Pages

Scroll/Zoom	100%

Producent	STMICROELECTRONICS [STMicroelectronics]

Strona internetowa	http://www.st.com

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13 / 26 page

5.3

Thermal characteristics of packages

The table below provides the thermal characteristics of the TSSOP28 and VFQFPN32 packages.

Table 4. Thermal characteristics

Parameter

Symbol

Value

Recommended operating temperature range

Ambient temperature

−40 to 105 °C

Case temperature

Junction temperature

−43 to 108 °C

Absolute maximum junction temperature

125 °C

Maximum power dissipation

63 mW

Theta-JA, -JB and -JC

Junction to ambient thermal resistance

θJA

35.8 at 0 lfpm (1)

Junction to case thermal resistance

θJC

1.48 at 0 lfpm(1)

Junction to board thermal resistance

θJB

13.9 at 0 lfpm(1)

1. Linear feet per minute.

ST33TPHF2ESPI

Thermal characteristics of packages

DB2716 - Rev 4

page 13/26

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