| Zakładka z wyszukiwarką danych komponentów |
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ST33TPHF2ESPI Arkusz danych(PDF) 16 Page - STMicroelectronics |
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ST33TPHF2ESPI Arkusz danych(HTML) 16 Page - STMicroelectronics |
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16 / 26 page ![]() Figure 12. Embossed carrier tape for TSSOP28 4.4 mm body width W T K Bo D P2 Po B1 Ao Bo P F E D1 User direction of feed Ko Top Cover Tape 1. Drawing is not to scale. Figure 13. Chip orientation in the embossed carrier tape for TSSOP28 4.4 mm body width Typical User direction of feed Table 8. Carrier tape constant dimensions for TSSOP 4.4 mm body width Tape size Ao, Bo, Ko (1) D E Po T Max. Unit 16 mm See note. 1.5 +0.1 / −0 1.75 ±0.1 4 ±0.1 0.4 mm 1. Ao, Bo, Ko, are determined by components sizes. The clearance between the component and the cavity must be within 0.05 mm (Min.) to 0.90 mm (Max.) ST33TPHF2ESPI Delivery packing DB2716 - Rev 4 page 16/26 |
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