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M24128X-FCU6T/TF Arkusz danych(PDF) 28 Page - STMicroelectronics

Numer części M24128X-FCU6T/TF
Szczegółowy opis  128-Kbit serial I²C bus EEPROM with configurable device address and software write protection, delivered in 4-ball CSP
PDF  35 Pages
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Producent  STMICROELECTRONICS [STMicroelectronics]
Strona internetowa  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

M24128X-FCU6T/TF Arkusz danych(HTML) 28 Page - STMicroelectronics

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Table 18. Ultra thin WLCSP- 4-bump, 0.851 x 0.851 mm, with BSC, wafer level chip scale package
mechanical data
Symbol
millimeters
inches(1)
Min
Typ
Max
Min
Typ
Max
A
0.265
0.295
0.330
0.0104
0.0116
0.0130
A1
-
0.095
-
-
0.0037
-
A2
-
0.175
-
-
0.0079
-
A3 (BSC)
-
0.025
-
-
0.0010
-
b(2)(3)
-
0.185
-
-
0.0073
-
D
-
0.851
0.871
-
0.0335
0.0343
E
-
0.851
0.871
-
0.0335
0.0343
e
-
0.400
-
-
0.0157
-
e1
-
0.500
-
-
0.0197
-
F
-
0.226
-
-
0.0089
-
G
-
0.176
-
-
0.0069
-
aaa
-
0.110
-
-
0.0043
-
bbb
-
0.110
-
-
0.0043
-
ccc
-
0.110
-
-
0.0043
-
ddd
-
0.060
-
-
0.0024
-
eee
-
0.060
-
-
0.0024
-
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
3. Primary datum Z and seating plane are defined by the spherical crowns of the bump.
Figure 17. Ultra thin WLCSP- 4-bump, 0.851 x 0.851 mm, wafer level chip scale recommended footprint
e1
e
4 bumps x
Ø 0.185 mm
M24128X-FCU
Ultra thin WLCSP4 package information
DS12680 - Rev 2
page 28/35



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