STM32L021D4 datasheet(8/114 Pages) STMICROELECTRONICS

Numer części	STM32L021D4

Szczegółowy opis	Access line ultra-low-power 32-bit MCU Arm®-based Cortex®-M0, 16KB Flash, 2KB SRAM, 512B EEPROM, ADC, AES

PDF	114 Pages

Scroll/Zoom	100%

Producent	STMICROELECTRONICS [STMicroelectronics]

Strona internetowa	http://www.st.com

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8 / 114 page

List of figures

STM32L021x4

8/114

DocID027982 Rev 5

package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103

Figure 41.

Example of UFQFPN20 marking (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104

Figure 42.

TSSOP20 – 20-lead thin shrink small outline, 6.5 x 4.4 mm, 0.65 mm pitch,

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105

Figure 43.

TSSOP20 – 20-lead thin shrink small outline, 6.5 x 4.4 mm, 0.65 mm pitch,

package footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106

Figure 44.

TSSOP14 – 14-lead thin shrink small outline, 5.0 x 4.4 mm, 0.65 mm pitch,

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107

Figure 45.

Example of TSSOP14 marking (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108

Figure 46.

Thermal resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109

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