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STM32L021D4 Arkusz danych(PDF) 11 Page - STMicroelectronics |
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STM32L021D4 Arkusz danych(HTML) 11 Page - STMicroelectronics |
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11 / 114 page ![]() DocID027982 Rev 5 11/114 STM32L021x4 Description 32 2.1 Device overview Table 1. Ultra-low-power STM32L021x4 device features and peripheral counts Peripheral STM32 L021D4 STM32 L021F4 STM32 L021G4 STM32L021K4 Flash (Kbytes) 16 Data EEPROM (bytes) 512 RAM (Kbytes) 2 AES 1 Timers General- purpose 2 LPTIM 1 RTC/SYSTICK/IWDG/ WWDG 1/1/1/1 Communication interfaces SPI 1 I2C 1 USART 1 LPUART 1 GPIOs 11 16 24 26/28(1) Clocks: HSE(2)/LSE/HSI/MSI/LSI 1/1/1/1/1 12-bit synchronized ADC Number of channels 1 4 1 7/9(3) 1 10 Comparators 2 Max. CPU frequency 32 MHz Operating voltage 1.8 V to 3.6 V (down to 1.65 V at power-down) with BOR option 1.65 V to 3.6 V without BOR option Operating temperatures Ambient temperature: –40 to +125 °C Junction temperature: –40 to +130 °C Packages TSSOP14 TSSOP20, UFQFPN20 UFQFPN28 LQFP32, UFQFPN32 1. The devices feature 26 and 28 GPIOs on LQFP32 and UFQFPN32, respectively. 2. HSE available only as external clock input (HSE bypass). 3. The devices feature 7 and 9 ADC channels on UFQFPN20 and TSSOP20, respectively. |
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