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PLMP7704HBH/EM Arkusz danych(PDF) 28 Page - Texas Instruments |
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PLMP7704HBH/EM Arkusz danych(HTML) 28 Page - Texas Instruments |
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28 / 31 page ![]() www.ti.com PACKAGE OUTLINE C 25 MAX 6X 1.27 2X 7.62 8X 0.482 0.382 2.874 MAX 0.18 0.10 0.43 MAX 0.18 MIN A 6.65 6.30 B 9.91 9.55 (4.45) (6.09) (9.27) 4X (R0.76) 4225069/A 06/2019 NOTES: CFP - 2.874 mm max height HBH0014A CERAMIC FLATPACK 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This package is hermetically sealed with a metal lid. The lid is not connected to any lead. 4. The leads are gold plated. 0.2 C A B 1 7 8 14 1 SCALE 1.000 7 8 14 PIN 1 ID LMP7704-SP SNOSDB6A – DECEMBER 2020 – REVISED JANUARY 2021 www.ti.com 28 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: LMP7704-SP |
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