6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

13.2

V

Voltage

Common-mode

(V–) – 0.3

(V+) + 0.3

V

Differential

(V+) – (V–) + 0.3

Current

±10

mA

Output short circuit(2)

Continuous

Continuous

Operating temperature

–55

150

°C

Junction temperature

150

°C

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

Short-circuit to ground, one amplifier per package.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

2.7

12

V

Specified temperature

–55

125

°C

6.4 Thermal Information

THERMAL METRIC(1)

LMP7704-SP

UNIT

HBH (CFP)

14 PINS

Junction-to-ambient thermal resistance

37.5

ºC/W

Junction-to-case(top) thermal resistance

20.6

ºC/W

Junction-to-board thermal resistance

21.3

ºC/W

Junction-to-top characterization parameter

12.9

ºC/W

Junction-to-board characterization parameter

21.0

ºC/W

Junction-to-case(bottom) thermal resistance

10.8

N/A

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

LMP7704-SP

SNOSDB6A – DECEMBER 2020 – REVISED JANUARY 2021

www.ti.com

4

Submit Document Feedback

Copyright © 2021 Texas Instruments Incorporated

Product Folder Links: LMP7704-SP