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MMD-3580L

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4. Die Mounting Recommendations

4.1 Mounting and Bonding Recommendations

Marki MMICs should be attached directly to a ground plane with conductive epoxy. The

ground plane electrical impedance should be as low as practically possible. This will

prevent resonances and permit the best possible electrical performance. Datasheet

performance is only guaranteed in an environment with a low electrical impedance ground.

Mounting - To epoxy the chip, apply a minimum amount of conductive epoxy to the

mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip.

Cure epoxy according to manufacturer instructions.

Wire Bonding - Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire.

Thermosonic wirebonding with a nominal stage temperature of 150 °C and a ball bonding

force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use

the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be

started on the chip and terminated on the package or substrate. All bonds should be as

short as possible <0.31 mm (12 mils).

Circuit Considerations – 50 Ω transmission lines should be used for all high frequency

connections in and out of the chip. Wirebonds should be kept as short as possible, with

multiple wirebonds recommended for higher frequency connections to reduce parasitic

inductance. In circumstances where the chip more than .001” thinner than the

substrate, a heat spreading spacer tab is optional to further reduce bondwire length and

parasitic inductance.

4.2 Handling Precautions

General Handling

Chips should be handled with care using tweezers or a vacuum collet. Users should take

precautions to protect chips from direct human contact that can deposit contaminants,

like perspiration and skin oils on any of the chip's surfaces.

Static Sensitivity

GaAs MMIC devices are sensitive to ESD and should be handled, assembled, tested, and

transported only in static protected environments.

Cleaning and Storage: Do not attempt to clean the chip with a liquid cleaning system or

expose the bare chips to liquid. Once the ESD sensitive bags the chips are stored in are

opened, chips should be stored in a dry nitrogen atmosphere.