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ADRF5019BCPZN-R7 Arkusz danych(PDF) 11 Page - Analog Devices

Numer części ADRF5019BCPZN-R7
Szczegółowy opis  Silicon, SPDT Switch, Nonreflective, 100 MHz to 13 GHz
PDF  12 Pages
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ADRF5019BCPZN-R7 Arkusz danych(HTML) 11 Page - Analog Devices

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Data Sheet
ADRF5019
Rev. 0 | Page 11 of 12
APPLICATIONS INFORMATION
LAYOUT CONSIDERATIONS
All measurements in this data sheet are measured on the
ADRF5019-EVALZ evaluation board. The design of the
ADRF5019-EVALZ board serves as a layout recommendation
for ADRF5019 application.
See the ADRF5019-EVALZ user guide for more information on
using the evaluation board.
BOARD LAYOUT
The ADRF5019-EVALZ is a 4-layer board. The outer copper
(Cu) layers are 0.7 mil to 2.2 mil plated and are separated by
dielectric materials. Figure 23 shows the ADRF5019-EVALZ
board stack up.
The board layout and stackup shown in Figure 23 are used to
make the measurements included in this data sheet.
Figure 23. ADRF5019-EVALZ Stack Up
All RF and dc traces are routed on the top copper layer. The
inner and bottom layers are ground planes that provide a solid
ground for the RF transmission lines. The top dielectric material
(H) is 10 mil Rogers RO4350, which allows optimal RF
performance. The middle and bottom dielectric layers provide
mechanical strength. The overall evaluation board thickness is
approximately 62 mil, which allows Subminiature Version A
(SMA) connectors to be connected at the board edges.
RF AND DIGITAL CONTROLS
The RF transmission lines use a coplanar waveguide (CPWG)
model with a width of 18 mil and a ground spacing (G) of 13 mil
and have a characteristic impedance of 50 Ω. For optimal RF
and thermal grounding, as many plated through vias as possible
are arranged around the transmission lines and under the
exposed pad of the package.
The RF input and output ports (RFC, RF1, and RF2) are
connected through 50 Ω transmission lines to the SMA
launchers. On the VDD and VSS supply traces, a 100 pF bypass
capacitor filters high frequency noise.
Figure 24 shows the simplified application circuit for the
ADRF5019.
Figure 24. Simplified Application Circuit
RO4350
1.5oz Cu (2.2mil)
1.5oz Cu (2.2mil)
0.5oz Cu (0.7mil)
0.5oz Cu (0.7mil)
1.5oz Cu (2.2mil)
1.5oz Cu (2.2mil)
W = 18mil
G = 13mil
T = 2.2mil
H = 10mil
12
100pF
11
10
1
3
4
9
2
ADRF5019
U1
GND
GND
RFC
RFC
GND
GND
VDD
VDD
LS
LS
RF2
RF1
VCTRL
VCTRL
VSS
VSS
100pF



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