ADRF5132

Data Sheet

Rev. B | Page 12 of 12

OUTLINE DIMENSIONS

3.10

3.00 SQ

2.90

0.32

0.25

0.20

1.80

1.70 SQ

1.60

1

0.50

BSC

BOTTOM VIEW

TOP VIEW

16

5

8

9

12

13

4

0.50

0.40

0.25

0.05 MAX

0.02 NOM

0.20 REF

0.20 MIN

COPLANARITY

0.08

0.80

0.75

0.70

COMPLIANT

SEATING

PLANE

SIDE VIEW

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

P IN 1

IN D IC AT O R AR E A OP T IO N S

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

PIN 1

INDICATOR

AREA

EXPOSED

PAD

Figure 18. 16-Lead Lead Frame Chip Scale Package [LFCSP]

3 mm × 3 mm Body and 0.75 mm Package Height

(CP-16-35)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

ADRF5132BCPZN

−40°C to +105°C

16-Lead Lead Frame Chip Scale Package [LFCSP]

CP-16-35

ADRF5132BCPZN-R7

−40°C to +105°C

16-Lead Lead Frame Chip Scale Package [LFCSP]

CP-16-35

ADRF5132-EVALZ

Evaluation Board

1

Z = RoHS Compliant Part.

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registered trademarks are the property of their respective owners.

D16424-0-8/19(B)