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MPC755EC Arkusz danych(PDF) 26 Page - NXP Semiconductors |
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MPC755EC Arkusz danych(HTML) 26 Page - NXP Semiconductors |
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26 / 56 page ![]() MPC755 RISC Microprocessor Hardware Specifications, Rev. 8 26 Freescale Semiconductor Pin Assignments Figure 17 (in Part A) shows the pinout of the MPC755, 360 PBGA and 360 CBGA packages as viewed from the top surface. Part B shows the side profile of the PBGA and CBGA package to indicate the direction of the top surface view. Part A Figure 17. Pinout of the MPC755, 360 PBGA and CBGA Packages as Viewed from the Top Surface A B C D E F G H J K L M N P R T 12 3 4 5 6 78 910 11 12 13 14 15 16 Not to Scale 17 18 19 U V W View Part B Die Substrate Assembly Encapsulant |
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