MPC755EC datasheet(10/56 Pages) NXP

10 / 56 page

MPC755 RISC Microprocessor Hardware Specifications, Rev. 8

Freescale Semiconductor

Electrical and Thermal Characteristics

Table 6 provides the DC electrical characteristics for the MPC755.

Table 5. Thermal Sensor Specifications

At recommended operating conditions (see Table 3)

Characteristic

Min

Max

Unit

Notes

Temperature range

127

°C

Comparator settling time

—

µs

2, 3

Resolution

—

°C

Accuracy

–12

+12

°C

Notes:

1. The temperature is the junction temperature of the die. The thermal assist unit’s raw output does not indicate an absolute

temperature, but must be interpreted by software to derive the absolute junction temperature. For information about the use

and calibration of the TAU, see Freescale Application Note AN1800/D, Programming the Thermal Assist Unit in the MPC750

Microprocessor.

2. The comparator settling time value must be converted into the number of CPU clocks that need to be written into the THRM3

SPR.

3. Guaranteed by design and characterization.

Table 6. DC Electrical Specifications

At recommended operating conditions (see Table 3)

Characteristic

Nominal

Bus

Voltage 1

Symbol

Min

Max

Unit

Notes

Input high voltage (all inputs except SYSCLK)

2.5

VIH

1.6

(L2)OVDD + 0.3

2, 3

3.3

VIH

2.0

(L2)OVDD + 0.3

2, 3

Input low voltage (all inputs except SYSCLK)

2.5

VIL

–0.3

0.6

3.3

VIL

–0.3

0.8

SYSCLK input high voltage

2.5

KVIH

1.8

OVDD + 0.3

3.3

KVIH

2.4

OVDD + 0.3

SYSCLK input low voltage

2.5

KVIL

–0.3

0.4

3.3

KVIL

–0.3

0.4

Input leakage current,

Vin = L2OVDD/OVDD

Iin

—10

µA

2, 3

High-Z (off-state) leakage current,

Vin = L2OVDD/OVDD

ITSI

—

µA

2, 3, 5

Output high voltage, IOH = –6 mA

2.5

VOH

1.7

—

3.3

VOH

2.4

—

Output low voltage, IOL = 6 mA

2.5

VOL

—0.45

3.3

VOL

—0.4

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