ADP1851ACPZ-R7 datasheet(6/24 Pages) AD

6 / 24 page

ADP1851

Data Sheet

Rev. B | Page 6 of 24

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

VIN, EN, RAMP

21 V

FB, COMP, SS/TRK, FREQ, SYNC, VCCO,

PGOOD

−0.3 V to +6 V

ILIM, SW to PGND

−0.3 V to +21 V

BST, DH to PGND

−0.3 V to +28 V

DL to PGND

−0.3 V to VCCO + 0.3 V

BST to SW

−0.3 V to +6 V

BST to PGND, 20 ns Transients

32 V

SW to PGND, 20 ns Transients

25 V

DL, SW, ILIM to PGND, 20 ns

Negative Transients

−8 V

PGND to AGND

−0.3 V to +0.3 V

PGND to AGND, 20 ns Transients

−8 V to +4 V

θJA (Natural Convection)1, 2

40°C/W

Operating Junction Temperature Range3

−40°C to +125°C

Storage Temperature Range

−65°C to +150°C

Maximum Soldering Lead Temperature

260°C

Measured with exposed pad attached to PCB.

Junction-to-ambient thermal resistance (θJA) of the package was calculated

or simulated on a multilayer PCB.

The junction temperature (TJ) of the device is dependent on the ambient

temperature (TA), the power dissipation of the device (PD), and the junction-

to-ambient thermal resistance of the package (θJA). Maximum junction

temperature is calculated from the ambient temperature and power

dissipation using the formula TJ = TA + PD × θJA.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

Absolute maximum ratings apply individually only, not in

combination. Unless otherwise specified, all other voltages are

referenced to AGND.

ESD CAUTION

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