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STM32F071C8 Arkusz danych(PDF) 97 Page - STMicroelectronics |
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STM32F071C8 Arkusz danych(HTML) 97 Page - STMicroelectronics |
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97 / 122 page ![]() DS10009 Rev 7 97/122 STM32F071x8 STM32F071xB Package information 118 7 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 7.1 UFBGA100 package information UFBGA100 is a 100-ball, 7 × 7 mm, 0.50 mm pitch, ultra-fine-profile ball grid array package. Figure 34. UFBGA100 package outline 1. Drawing is not to scale. Table 70. UFBGA100 package mechanical data Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. A - - 0.600 - - 0.0236 A1 - - 0.110 - - 0.0043 A2 - 0.450 - - 0.0177 - A3 - 0.130 - - 0.0051 0.0094 A4 - 0.320 - - 0.0126 - A0C2_ME_V5 Seating plane A1 e Z Z D M Øb (100 balls) A E TOP VIEW BOTTOM VIEW 1 12 A1 ball identifier e A A2 Y X Z ddd Z D1 E1 eee ZY X fff Ø Ø M M Z A3 A4 A1 ball index area |
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