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STM32F071C8 Arkusz danych(PDF) 98 Page - STMicroelectronics |
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STM32F071C8 Arkusz danych(HTML) 98 Page - STMicroelectronics |
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98 / 122 page ![]() Package information STM32F071x8 STM32F071xB 98/122 DS10009 Rev 7 Figure 35. Recommended footprint for UFBGA100 package b 0.240 0.290 0.340 0.0094 0.0114 0.0134 D 6.850 7.000 7.150 0.2697 0.2756 0.2815 D1 - 5.500 - - 0.2165 - E 6.850 7.000 7.150 0.2697 0.2756 0.2815 E1 - 5.500 - - 0.2165 - e - 0.500 - - 0.0197 - Z - 0.750 - - 0.0295 - ddd - - 0.080 - - 0.0031 eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 71. UFBGA100 recommended PCB design rules Dimension Recommended values Pitch 0.5 Dpad 0.280 mm Dsm 0.370 mm typ. (depends on the solder mask registration tolerance) Stencil opening 0.280 mm Stencil thickness Between 0.100 mm and 0.125 mm Table 70. UFBGA100 package mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. A0C2_FP_V1 Dpad Dsm |
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