MPC7410EC datasheet(31/56 Pages) NXP

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MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1

Freescale Semiconductor

Package Description

7.4 Mechanical Dimensions for the MPC7410, 360 HCTE_CBGA

(Lead Free C5 Spheres)

Figure 18 provides the mechanical dimensions and bottom surface nomenclature of the MPC7410,

360 HCTE_CBGA (lead-free C5 spheres) package.

Figure 18. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC7410

360 HCTE_CBGA (Lead-Free C5 Spheres) Package

NOTES:

1. DIMENSIONING AND TOLERANCING

PER ASME Y14.5M, 1994.

2. DIMENSIONS IN MILLIMETERS.

3. TOP SIDE A1 CORNER INDEX IS A

METALIZED FEATURE WITH

VARIOUS SHAPES. BOTTOM SIDE A1

CORNER IS DESIGNATED WITH A

BALL MISSING FROM THE ARRAY.

Millimeters

DIM

MIN

MAX

2.32

2.80

0.40

0.60

1.10

1.30

—

0.60

0.82

0.90

0.60

0.90

25.00 BSC

—

12.50

6.00

9.00

e1.27 BSC

25.00 BSC

—

14.30

8.00

11.00

22.86 BSC

—

9.75

6.46

—

8.20

8.60

2.75

—

9.50

6.94

—

3.10

3.30

3.00

—

0.15 C

0.25 C

0.35 C

360X

123456789 10 11 1213141516

0.3

0.15

171819

0.2

A1 CORNER

0.2

Capacitor Region

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