MPC7410EC datasheet(45/56 Pages) NXP

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MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1

Freescale Semiconductor

System Design Information

Figure 29 describes the thermal performance of selected thermal interface materials.

Figure 29. Thermal Performance of Select Thermal Interface Material

The board designer can choose between several types of thermal interface. Heat sink adhesive materials should be

selected based on high conductivity, yet adequate mechanical strength to meet equipment shock/vibration

requirements. There are several commercially-available thermal interfaces and adhesive materials provided by the

following vendors:

Chomerics, Inc.

781-935-4850

77 Dragon Court

Woburn, MA 01888-4014

Internet: www.chomerics.com

Dow-Corning Corporation

800-248-2481

Dow-Corning Electronic Materials

2200 W. Salzburg Rd.

Midland, MI 48686-0997

Internet: www.dow.com

Shin-Etsu MicroSi, Inc.

888-642-7674

10028 S. 51st St.

Phoenix, AZ 85044

Internet: www.microsi.com

0.5

1.5

3040506070

Silicone Sheet (0.006")

Bare Joint

Floroether Oil Sheet (0.007")

Graphite/Oil Sheet (0.005")

Synthetic Grease

Contact Pressure (psi)

MPC7410EC Arkusz danych(PDF) 45 Page - NXP Semiconductors