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TDA7708 Arkusz danych(PDF) 5 Page - STMicroelectronics |
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TDA7708 Arkusz danych(HTML) 5 Page - STMicroelectronics |
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5 / 8 page ![]() 3 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 3.1 VFQFPN-64 (9x9x1.0mm) package information Figure 2. VFQFPN-64 (9x9x1.0 mm) package outline 8511068_B_A0ZG A A D (A1) A1 E1 E B B C SECTION C-C SCALE: NONE TERMINAL TIP DETAIL A SCALE: NONE A1 C TERMINAL TIP SEATING PLANE SEE DETAIL A C C C A A2 A1 P P b bbb ddd e 64 2 3 1 A3 E2 D2 0.45 Pin1 ID r 0.20 L L1 64 0.80 DIA. TOP VIEW BOTTOM VIEW 1 2 3 D1 GAPGPS03460 A B C C C ccc eee fff B A C fff 4 x θ L2 b b1 Table 4. VFQFPN-64 (9x9x1.0 mm) package mechanical data Ref. Dimensions in mm Min. Typ. Max. Θ - - 14 A - - 1.0 A1 0.00 - 0.05 A2 0.55 - 0.80 A3 0.20 REF b(1) 0.18 0.25 0.30 TDA7708 Package information DB2482 - Rev 5 page 5/8 |
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