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STM32L082KB Arkusz danych(PDF) 124 Page - STMicroelectronics

Numer części STM32L082KB
Szczegółowy opis  Ultra-low-power 32-bit MCU Arm®-based Cortex®-M0, up to 192KB Flash, 20KB SRAM, 6KB EEPROM, USB, ADC, DACs, AES
PDF  132 Pages
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Producent  STMICROELECTRONICS [STMicroelectronics]
Strona internetowa  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32L082KB Arkusz danych(HTML) 124 Page - STMicroelectronics

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Package information
STM32L082xx
124/132
DS10688 Rev 7
7.5
Thermal characteristics
The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated
using the following equation:
TJ max = TA max + (PD max × ΘJA)
Where:
•
TA max is the maximum ambient temperature in ° C,
•ΘJA is the package junction-to-ambient thermal resistance, in ° C/W,
•
PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),
•
PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip
internal power.
PI/O max represents the maximum power dissipation on output pins where:
PI/O max = Σ (VOL × IOL) + Σ((VDD – VOH) × IOH),
taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the
application.
Table 82. Thermal characteristics(1)
1. TBD stands fro “to be defined”.
Symbol
Parameter
Value
Unit
ΘJA
Thermal resistance junction-ambient
UFQFPN32 - 5 x 5 mm / 0.5 mm pitch
36
°C/W
Thermal resistance junction-ambient
LQFP32 - 7 x 7 mm / 0.8 mm pitch
60
Thermal resistance junction-ambient
UFQFPN48 - 7 x 7 mm / 0.5 mm pitch
28
Thermal resistance junction-ambient
WLCSP49 - 0.4 mm pitch
48



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