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CSCF3218 Arkusz danych(PDF) 4 Page - Shenzhen Codaca Electronic Co.,Ltd |
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CSCF3218 Arkusz danych(HTML) 4 Page - Shenzhen Codaca Electronic Co.,Ltd |
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4 / 5 page ![]() 4 / 5 CODACA ELECTRONIC CO., LTD TEL : +86 755 89585372 FAX : +86 755 89585280 http://www.codaca.com E-mail: info@codaca.com High Current Power Inductor CSCF3218 Series This product is not authorized for use in any application related to safety. Specification subject to change without notice.Please check web site for latest information. Revised: 07/14/2020 6 Soldering Specification 6.1 Reflow Profile for SMT Components 6.2 Classification of Peak Package Body Temperature (TP) Package Thickness Package Volume <350 mm 3 350 2000 mm 3 >2000 mm 3 PB-Free Assembly <1.6mm 260 260 260 1.6 2.5mm 260 250 245 ≥2.5mm 250 245 245 Reflow is referred to standard IPC/JEDEC J-STD-020D. 480s Max. (Time of 25℃ to peak temperature) 25 Preheat Area TS Max. 200 TS Min. 150 tS 60~120s Max. Ramp Up Rate = 3 /s Max. Ramp Down Rate = 6 /s TP TL 217 TC -5 tP 20~30s tL 60~150s T( ) t( s) Time |
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