| Zakładka z wyszukiwarką danych komponentów |
|
SAM9X60 Arkusz danych(PDF) 29 Page - Microchip Technology |
|
|
|||||||||||||||||||||||||||||
SAM9X60 Arkusz danych(HTML) 29 Page - Microchip Technology |
|
29 / 40 page ![]() Table 9-1. 233-Ball TFBGA Package Characteristics Moisture Sensitivity Level 3 Table 9-2. Device and 233-Ball TFBGA Package Weight Device Weight (mg) SAM9X60D5M 394 SAM9X60D1G 399 Table 9-3. Package Reference JEDEC Drawing Reference NA J-STD-609 Classification e8 Table 9-4. 233-Ball TFBGA Package Information Ball Land 0.45 ± 0.05 mm Nominal Ball Diameter 0.4 mm Solder Mask Opening 0.35 ± 0.03 mm Solder Mask Definition SMD Solder SAC105 SAM9X60 SIP Mechanical Characteristics © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS60001580C-page 29 |
|
Link URL |
| Czy Alldatasheet okazała się pomocna? [ DONATE ] |
O Alldatasheet | Reklama | Kontakt | Polityka prywatności | Link do karty katalogowej | Linki | Lista producentów All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |