Audio Amplification Transistor

2SA2151

5

9.6 ±0.3

15.8 ±0.2

5.0 MAX

2.1 MAX

Terminal dimension at lead tips

2(2×)

+0.2

–0.1

3

+0.2

–0.1

1.0

(3×)

+0.2

–0.1

0.6

+0.2

–0.1

1.7

+0.2

–0.3

Branding

XXXXXXXX

XXXXXXXX

Terminal core material: Cu

Terminal treatment: Ni plating and solder dip

Heat sink core material: Cu

Heat sink treatment: Ni plating

Leadform number: 100

Dimensions in millimeters

Branding codes (exact appearance at manufacturer discretion):

1st line,

type: A2151

2nd line, lot:

YM

H

Where: Y is the last digit of the year of manufacture

M is the month (1 to 9, O, N, D)

footnote, Electrical Characteristics table)

Pin Assignments:

1. Base

2. Collector

3. Emitter

123

2×P5.45 ±0.1

13.6 ±0.2

14.0 ±0.3

15.6 ±0.3

PACKAGE OUTLINE DRAWING, TO-3P

Leadframe plating Pb-free. Device composition

includes high-temperature solder (Pb >85%),

which is exempted from the RoHS directive.

Allegro MicroSystems, Inc.

115 Northeast Cutoff, Box 15036

Worcester, Massachusetts 01615-0036 (508) 853-5000

www.allegromicro.com