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AM263P4 Arkusz danych(PDF) 98 Page - Texas Instruments |
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AM263P4 Arkusz danych(HTML) 98 Page - Texas Instruments |
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98 / 154 page ![]() EHRPWM_SOCA/B PWM5 EPERIPHERALS_TIMNG_04 EHRPWM_SYNCO PWM2 EHRPWM_A/B PWM1 PWM1 Figure 6-17. EHRPWM Switching Characteristics EHRPWM_A/B EHRPWM_TZn_IN EPERIPHERALS_TIMING_05 PWM3 Figure 6-18. EHRPWM_TZn_IN to EHRPWM_A/B Forced Switching Characteristics EHRPWM_A/B EHRPWM_TZn_IN PWM4 Figure 6-19. EHRPWM_TZn_IN to EHRPWM_A/B Hi-Z Switching Characteristics EPWM Characteristics PARAMETER MIN TYP MAX UNIT Micro Edge Positioning (MEP) step size(1) TBD TBD ps (1) The MEP step size will be largest at high temperature and minimum voltage on VDD. MEP step size will increase with higher temperature and lower voltage and decrease with lower temperature and higher voltage. Applications that use the HRPWM feature should use MEP Scale Factor Optimizer (SFO) estimation software functions. See the TI software libraries for details of using SFO functions in end applications. SFO functions help to estimate the number of MEP steps per SYSCLK period dynamically while the HRPWM is in operation. TI Information - Selective Disclosure AM263P4, AM263P2, AM263P1, AM263P4-Q1, AM263P2-Q1, AM263P1-Q1 SPRSP81 – OCTOBER 2023 www.ti.com 98 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated |
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