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Zakładka z wyszukiwarką danych komponentów |
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Zakładka z wyszukiwarką danych komponentów |
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TMF8805 Arkusz danych(PDF) 70 Page - OSRAM GmbH |
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TMF8805 Arkusz danych(HTML) 70 Page - OSRAM GmbH |
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70 / 74 page  TMF8805 Soldering & storage information Datasheet • PUBLIC • Document Feedback DS000692 • v7-00 • 2023-Dec-01 70 / 74 / 10 Soldering & storage information 10.1 Soldering information The package has been tested and has demonstrated an ability to be reflow soldered to a PCB substrate. The process, equipment, and materials used in these test are detailed below. The solder reflow profile describes the expected maximum heat exposure of components during the solder reflow process of product on a PCB. Temperature is measured on top of component. The components should be limited to a maximum of three passes through this solder reflow profile. Figure 18: Solder reflow profile graph Table 111: Solder reflow profile Parameter Reference Device Average temperature gradient in preheating 2.5 °C/s Soak time tsoak 2 to 3 minutes Time above 217 °C (T1) t1 Max 60 s |
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