TSL25413 datasheet(31/39 Pages) OSRAM

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[v2-00] 2023-Mar-10

TSL2541 − Soldering & Storage Information

The QFN package has been tested and has demonstrated an

ability to be reflow soldered to a PCB substrate. The solder

reflow profile describes the expected maximum heat exposure

of components during the solder reflow process of product on

a PCB. Temperature is measured on top of component. The

components should be limited to a maximum of three passes

through this solder reflow profile.

Figure 43:

Solder Reflow Profile

Figure 44:

Solder Reflow Profile Graph

Parameter

Reference

Device

Average temperature gradient in preheating

2.5°C/s

Soak time

tSOAK

2 to 3 minutes

Time above 217°C (T1)t1

Max 60s

Time above 230°C (T2)t2

Max 50s

Time above Tpeak - 10°C (T3)t3

Max 10s

Peak temperature in reflow

Tpeak

260°C

Temperature gradient in cooling

Max - 5°C/s

Soldering & Storage

Information

tsoak

Tpeak

Not to scale — for reference only

Time (sec)

(s)

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