SP4T PIN Diode Switch

MA4SW410

V 1.00

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or information contained herein without notice.

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3

Eutectic Die Attachment

An 80/20 Gold-Tin eutectic solder preform is recommended

with a work surface temperature of 255

temperature of 265

temperature should be 290

to temperatures greater than 320

No more than three seconds should be required for the attachment.

Electrical Epoxy

Die Attachment

Assembly should be preheated to 125-150

thickness of 2 mils is recommended for best electrical and

thermal conductivity.

A thin epoxy fillet should be visible

around the perimeter of the chip after placement. Cure epoxy

per manufacturer’s schedule.

Assembly Considerations

The following precautions should be observed for successful

assembly of the die.

Cleanliness

These chips should be handled in a clean environment. Do not

attempt to clean die after installation.

Electro-Static Sensitivity

The MA4SW Series PIN switches are ESD, Class 1 sensitive.

The proper ESD handling procedures should be used.

Die Wire Bonding

Thermosonic wedge wire bonding using ¼ x 3 mil sq. ribbon

or Ball Bonding using 1 mil

diameter gold wire is

recommended. A stage temperature of 150

18 to 22 grams should be used. Ultrasonic energy should be

adjusted to the minimum required. RF bonds should be as

short as possible.

Die Mounting

These chips have Ti-Pt-Au back metal. They can be die

mounted with a gold-tin eutectic solder preform or conductive

Ag epoxy. Mounting surface must be clean and flat.