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CLB05B5220K1000TC1 Arkusz danych(PDF) 1 Page - Murata Manufacturing Co., Ltd |
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CLB05B5220K1000TC1 Arkusz danych(HTML) 1 Page - Murata Manufacturing Co., Ltd |
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1 / 2 page ![]() Product Search Data Sheet CLB05B5220K1000TC1 Note: If you have not downloaded this document from our official website, please note that the information provided may not be the most current. Please download the latest datasheet of CLB05B5220K1000TC1 from the official website of Murata http://www.murata.com/en/products/productdetail?partno=CLB05B5220K1000TC1 Attention 1.This datasheet is downloaded from the website of Murata Manufacturing Co., Ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before ordering. 2.This datasheet has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. URL : https://www.murata.com/ Last updated06/20/2024 Applications Unsuitable Applications Please be sure to read and comply with these "Precautions for use." Specific Applications Consumer equipment,Industrial Equipment,Mobile Electronics Please refer to Our Website and specifications, etc. for information about the performance, functions, quality, management, and safety required for the above applications, and use Products after confirming the performance and reliability of the actual Product. Recommended Applications Consumer equipment,Router,Wi-Fi Router,Optical Backbone network, Optical Module,Mobile Electronics,Base Station,RF Power Amplifier,Industrial Equipment Appearance & Shape Features 1. Fine grained high-density ceramic dielectric, pure gold electrode and simple single layer structure provide very reliable performance and excellent frequency characteristics. 2. Awide selection of sizes from very miniature 0.25mm square is suited to high-density mounting. 3. For compatibility with the gold electrodes, die bonding with Au-Sn is possible and wire bonding with gold wire is possible. 4. To improve handling of bonding, Au-Sn coating is available on one side or both sides. 5. Custom made type (dimensions, cap. values, etc.) are also available upon request. Applications 1. Microwave Integrated Circuits 2. Microwave Devices 3. Optical Devices 4. Measuring Equipments 1 of 2 |
Podobny numer części - CLB05B5220K1000TC1 |
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Podobny opis - CLB05B5220K1000TC1 |
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