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MPC8555CPXAPF Arkusz danych(PDF) 69 Page - Freescale Semiconductor, Inc

Numer części MPC8555CPXAPF
Szczegółowy opis  PowerQUICC??III Integrated Communications Processor Hardware Specifications
PDF  88 Pages
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Producent  FREESCALE [Freescale Semiconductor, Inc]
Strona internetowa  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MPC8555CPXAPF Arkusz danych(HTML) 69 Page - Freescale Semiconductor, Inc

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MPC8555E PowerQUICC™ III Integrated Communications Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
69
Thermal
Figure 42. Package Exploded Cross-Sectional View with Several Heat Sink Options
The system board designer can choose between several types of heat sinks to place on the MPC8555E.
There are several commercially-available heat sinks from the following vendors:
Aavid Thermalloy
603-224-9988
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Alpha Novatech
408-749-7601
473 Sapena Ct. #15
Santa Clara, CA 95054
Internet: www.alphanovatech.com
International Electronic Research Corporation (IERC)
818-842-7277
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Millennium Electronics (MEI)
408-436-8770
Loroco Sites
671 East Brokaw Road
San Jose, CA 95112
Internet: www.mei-millennium.com
Tyco Electronics
800-522-6752
Chip Coolers™
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
Wakefield Engineering
603-635-5102
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
Heat Sink
FC-PBGA Package
Heat Sink
Clip
Printed-Circuit Board
Die
Lid
Thermal Interface Material



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