PPC405EP datasheet(36/50 Pages) AMCC

36 / 50 page

PPC405EP – PowerPC 405EP Embedded Processor

AMCC

Revision 1.07 – September 10, 2007

Data Sheet

Note:

1. For a chip mounted on a JEDEC 2S2P card without a heat sink.

2. For a chip mounted on a card with at least one signal and two power planes, the following relationships exist:

a. Case temperature, TC, is measured at top center of case surface with device soldered to circuit board.

b. TA = TC – P×θCA, where TA is ambient temperature and P is power consumption.

VDD

Logic voltage—1.8V.

Other pins

Reserved

Reserved pins. Do not make voltage, ground, or signal connections to

these pins.

Table 7. Absolute Maximum Ratings

The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause

permanent damage to the device. None of the performance specification contained in this document are guaranteed when

operating at these maximum ratings.

Characteristic

Symbol

Value

Unit

Supply Voltage (Internal Logic)

VDD

0 to +1.95

Supply Voltage (I/O Interface)

OVDD

0 to +3.6

PLL Supply Voltage

AVDD

0 to +1.95

Input Voltage (1.8V CMOS receivers)

VIN

0 to +1.95

Input Voltage (3.3V LVTTL receivers)

VIN

0 to +3.6

Input Voltage (5.0V LVTTL receivers)

VIN

0 to +5.5

Storage Temperature Range

TSTG

-55 to +150

°C

Case temperature under bias

-40 to +120

°C

Note: All specified voltages are with respect to GND.

Table 8. Package Thermal Specifications

The PPC405EP is designed to operate within a case temperature range of -40°C to +85°C. Thermal resistance values for the E-

PBGA packages in a convection environment are as follows:

Package—Thermal Resistance

Symbol

Airflow

ft/min (m/sec)

Unit

0 (0)

100 (0.51)

200 (1.02)

31mm, 385-balls—Junction-to-Case

°C/W

31mm, 385-balls—Case-to-Ambient1

17.8

16.8

16.1

°C/W

Table 6. Signal Functional Description (Sheet 6 of 6)

Secondary multiplexed signals are shown in brackets.

Notes:

1. Receiver input has hysteresis.

2. Must pull up. See “Pull-Up and Pull-Down Resistors” on page 29 for recommended termination values.

3. Must pull down. See “Pull-Up and Pull-Down Resistors” on page 29 for recommended termination values.

4. If not used, must pull up.

5. If not used, must pull down.

6. Strapping input during reset; pull up or pull down as required.

7. Pull-up may be required. See “External Bus Control Signals” on page 30.

Signal Name

Description

I/O

Type

Notes

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