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LP5521TM Arkusz danych(PDF) 2 Page - Texas Instruments

Numer części LP5521TM
Szczegółowy opis  LP5521 Three-Channel RGB, White-LED Driver With Internal Program Memory and Integrated Charge Pump
PDF  51 Pages
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Producent  TI2 [Texas Instruments]
Strona internetowa  https://www.ti.com
Logo TI2 - Texas Instruments

LP5521TM Arkusz danych(HTML) 2 Page - Texas Instruments

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LP5521
SNVS441I – JANUARY 2007 – REVISED NOVEMBER 2016
www.ti.com
Product Folder Links: LP5521
Submit Documentation Feedback
Copyright © 2007–2016, Texas Instruments Incorporated
Table of Contents
1
Features .................................................................. 1
2
Applications ........................................................... 1
3
Description ............................................................. 1
4
Revision History..................................................... 2
5
Pin Configuration and Functions ......................... 3
6
Specifications......................................................... 5
6.1
Absolute Maximum Ratings ..................................... 5
6.2
ESD Ratings.............................................................. 5
6.3
Recommended Operating Conditions ....................... 5
6.4
Thermal Information .................................................. 6
6.5
Electrical Characteristics........................................... 6
6.6
Charge Pump Electrical Characteristics ................... 7
6.7
LED Driver Electrical Characteristics (R, G, B
Outputs) ..................................................................... 7
6.8
Logic Interface Characteristics.................................. 7
6.9
I2C Timing Requirements (SDA, SCL)...................... 8
6.10
Typical Characteristics ............................................ 9
7
Detailed Description ............................................ 11
7.1
Overview ................................................................. 11
7.2
Functional Block Diagram ....................................... 11
7.3
Feature Description................................................. 12
7.4
Device Functional Modes........................................ 18
7.5
Programming........................................................... 19
7.6
Register Maps ......................................................... 28
8
Application and Implementation ........................ 36
8.1
Application Information............................................ 36
8.2
Typical Applications ................................................ 36
8.3
Initialization Setup ................................................... 39
9
Power Supply Recommendations ...................... 40
10
Layout................................................................... 40
10.1
Layout Guidelines ................................................. 40
10.2
Layout Example .................................................... 40
11
Device and Documentation Support ................. 41
11.1
Device Support...................................................... 41
11.2
Documentation Support ........................................ 41
11.3
Receiving Notification of Documentation Updates 41
11.4
Community Resources.......................................... 41
11.5
Trademarks ........................................................... 41
11.6
Electrostatic Discharge Caution ............................ 41
11.7
Glossary ................................................................ 41
12
Mechanical, Packaging, and Orderable
Information ........................................................... 41
4 Revision History
Changes from Revision H (May 2016) to Revision I
Page
Changed wording of title ........................................................................................................................................................ 1
Changes from Revision G (September 2014) to Revision H
Page
Added several new Applications ............................................................................................................................................ 1
Changed Body Size of DSBGA package to MAX dimensions .............................................................................................. 1
Changed Handling Ratings to ESD Ratings table ................................................................................................................. 5
Changed RθJA value for DSBGA from 50 – 90°C/W to 70.7°C/W and WQFN from 37 – 90°C/W to 38.4°C/W; add
additional thermal information ................................................................................................................................................ 6
Added Community Resources ............................................................................................................................................. 41
Changes from Revision F (February 2013) to Revision G
Page
Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device
Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout
section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information
section ................................................................................................................................................................................... 1



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