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CC2640R2FYFVT.B Arkusz danych(PDF) 71 Page - Texas Instruments |
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CC2640R2FYFVT.B Arkusz danych(HTML) 71 Page - Texas Instruments |
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71 / 74 page ![]() www.ti.com PACKAGE OUTLINE C 32X 0.3 0.2 3.45 0.1 32X 0.5 0.3 1 MAX (0.2) TYP 0.05 0.00 28X 0.5 2X 3.5 2X 3.5 A 5.1 4.9 B 5.1 4.9 (0.1) VQFN - 1 mm max height RHB0032E PLASTIC QUAD FLATPACK - NO LEAD 4223442/B 08/2019 PIN 1 INDEX AREA 0.08 C SEATING PLANE 1 8 17 24 9 16 32 25 (OPTIONAL) PIN 1 ID 0.1 C A B 0.05 C EXPOSED THERMAL PAD 33 SYMM SYMM NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. SCALE 3.000 SEE SIDE WALL DETAIL 20.000 SIDE WALL DETAIL OPTIONAL METAL THICKNESS |
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