L9963E datasheet(11/184 Pages) STMICROELECTRONICS

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Symbol

Parameter

Test conditions

Min.

Typ.

Max.

Unit

ISENSEP/M

-0.3

4.5

VCOM

-0.3

VANA

-0.3

4.5

VREG

-0.3

NPNDRV

-0.3

CAP1

-0.3

VBAT + 0.3V

CAP2

VREG – 0.3V

VBAT + 7V

DGND, CGND

-0.3

+ 0.3

GNDREF shorted to AGND

Table 4. ESD protection

Item

Parameter

Test conditions

Min.

Typ.

Max.

Unit

All pins Except Isolated

Communication Terminals and

Global pins(1)

HBM(2)

-2

Isolated Communication

Terminals(1)(2) and Global pins

versus all GND+EP connected

-4

All pins except Corner Pins

CDM(3)

-500

500

Corner Pins

-750

750

All pins

Latch up(4)

-100

100

1. Tested per AEC-Q100-002.

2. Isolated Communication Terminals: ISOHP, ISOHM, ISOLP_SDI, ISOLM_NCS.

3. Tested per AEC-Q100-011.

4. Tested per AEC-Q100-004, Class-2, Level-A.

Pins are all GND connected together.

3.3

Temperature ranges and thermal data

Table 5. Temperature ranges and thermal data

Symbol

Parameter

Test conditions

Min

Max

Unit

Tamb

Operating and testing temperature (ECU environment)

-40

105

°C

Junction temperature for all parameters

-40

125

°C

Tstg

Storage temperature

-65

150

°C

Tot

Thermal shut-down temperature (junction)

175

200

°C

Tot

Temperature ADC accuracy

-10

+10

°C

O Thys

Thermal shut-down temperature hysteresis

°C

RThj-amb

Thermal resistance junction-to-ambient(1)

°C/W

1. In “2s2p”, the “s” suffix stands for “Signal” and the number before indicates how many PCB layers are dedicated to signal

wires. The “p” suffix stands for “Power” and the number before indicates how many PCB layers are dedicated to power

planes.

L9963E

Temperature ranges and thermal data

DS13636 - Rev 12

page 11/184

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