6.7 Typical Characteristics (LM50B and LM50C) (continued)

To generate these curves the device is mounted to a printed circuit board as shown in Figure 8-14 or Figure 8-15.

Figure 6-7. Thermal Response in Still Air Without a Heat Sink

(Legacy chip)

TIME (Seconds)

0

100

200

300

400

500

600

0

25

50

75

100

125

New chip

Legacy chip

Figure 6-8. Thermal Response in Still Air Without a Heat Sink

(Both Legacy and New Chip in the New Test Setup)

Figure 6-9. Start-Up Voltage vs Temperature (Legacy chip)

TEMPERATURE (C)

-50

-25

0

25

50

75

100

125

1

1.25

1.5

1.75

2

2.25

2.5

2.75

3

Figure 6-10. Start-Up Voltage vs Temperature (New chip)

Figure 6-11. Quiescent Current vs Temperature (Legacy chip)

TEMPERATURE (C)

-50

-25

0

25

50

75

100

125

30

50

70

90

110

130

150

+VS = +5V

Figure 6-12. Quiescent Current vs Temperature (New chip)

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LM50, LM50HV

SNIS118I – JULY 1999 – REVISED OCTOBER 2025

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