ADRF5702BCCZN-R7 datasheet(9/27 Pages) AD

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Data Sheet

ADRF5702

ABSOLUTE MAXIMUM RATINGS

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Rev. A | 9 of 27

Table 4. Absolute Maximum Ratings

Parameter

Rating

Positive Supply Voltage

−0.5V to +5.5V

Digital Control Inputs

Voltage

−0.3V to +3.6V

Current

3mA

RF Power1 (f = 50MHz to 18GHz, TCASE = 85°C2)

Input at ATTIN

Average (5V or 3.3V, All Attenuation States)

27.5dBm

Peak

5V, Attenuation State < 8dB

32.5dBm

5V, Attenuation State ≥ 8dB

29.5dBm

3.3V, Attenuation State < 8dB

30.5dBm

3.3V, Attenuation State ≥ 8dB

27.5dBm

Hot Switching (5V or 3.3V, All Attenuation States)

27.5dBm

Input at ATTOUT

Average

5V or 3.3V, Attenuation State < 8dB

27.5dBm

5V or 3.3V, Attenuation State ≥ 8dB

24.5dBm

Peak

5V, Attenuation State < 8dB

32.5dBm

5V, Attenuation State ≥ 8dB

29.5dBm

3.3V, Attenuation State < 8dB

30.5dBm

3.3V, Attenuation State ≥ 8dB

27.5dBm

Hot Switching (5V or 3.3V, All Attenuation States)

24.5dBm

Unbiased (VDD = 0V, Input at ATTIN and ATTOUT)

27dBm

Temperature

Junction (TJ)

135°C

Storage

−65°C to 150°C

Reflow

260°C

1 For RF power handling derating over extended frequency range, see Figure 2.

2 For TCASE = 105°C operation, the RF power handling derates from the TCASE =

85°C specifications by 3 dB.

Stresses at or above those listed under absolute maximum ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to PCB

thermal design is required.

θJC is the junction to case bottom (channel to carrier bottom)

thermal resistance.

Table 5. Thermal Resistance

Package Type

θJC1

Unit

CC-24-20

100

°C/W

1 θJC was determined by simulation under the following conditions: the heat

transfer is due solely to thermal conduction from the channel through the

round pad to the PCB, and the ground pad is held constant at the operating

temperature of 85°C.

POWER DERATING CURVES

Figure 2. Power Derating vs. Frequency, Low Frequency Detail, TCASE = 85°C

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