MPC7447A datasheet(9/60 Pages) FREESCALE

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MPC7448 RISC Microprocessor Hardware Specifications, Rev. 4

Freescale Semiconductor

General Parameters

The following list summarizes the general parameters of the MPC7448:

Technology

90 nm CMOS SOI, nine-layer metal

Die size

8.0 mm

× 7.3 mm

Transistor count

90 million

Logic design

Mixed static and dynamic

Packages

Surface mount 360 ceramic ball grid array (HCTE)

Surface mount 360 ceramic land grid array (HCTE)

Surface mount 360 ceramic ball grid array with lead-free spheres (HCTE)

Core power supply

1.30 V

(1700 MHz device)

1.25 V

(1600 MHz device)

1.20 V

(1420 MHz device)

1.15 V

(1000 MHz device)

I/O power supply

1.5 V, 1.8 V, or 2.5 V

Electrical and Thermal Characteristics

This section provides the AC and DC electrical specifications and thermal characteristics for the

MPC7448.

5.1

DC Electrical Characteristics

The tables in this section describe the MPC7448 DC electrical characteristics. Table 2 provides the

absolute maximum ratings. See Section 9.2, “Power Supply Design and Sequencing,” for power

sequencing requirements.

Table 2. Absolute Maximum Ratings 1

Characteristic

Symbol

Maximum Value

Unit

Notes

Core supply voltage

VDD

–0.3 to 1.4

PLL supply voltage

AVDD

–0.3 to 1.4

Processor bus supply voltage

I/O Voltage Mode = 1.5 V

OVDD

–0.3 to 1.8

I/O Voltage Mode = 1.8 V

–0.3 to 2.2

I/O Voltage Mode = 2.5 V

–0.3 to 3.0

Input voltage

Processor bus

Vin

–0.3 to OVDD + 0.3

JTAG signals

Vin

–0.3 to OVDD + 0.3

Storage temperature range

Tstg

– 55 to 150

•C

Notes:

1. Functional and tested operating conditions are given in Table 4. Absolute maximum ratings are stress ratings only and

functional operation at the maximums is not guaranteed. Stresses beyond those listed may affect device reliability or cause

permanent damage to the device.

2. See Section 9.2, “Power Supply Design and Sequencing” for power sequencing requirements.

3. Bus must be configured in the corresponding I/O voltage mode; see Table 3.

4. Caution: Vin must not exceed OVDD by more than 0.3 V at any time including during power-on reset except as allowed by

the overshoot specifications. Vin may overshoot/undershoot to a voltage and for a maximum duration as shown in Figure 2.

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