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MPC7441 Arkusz danych(PDF) 30 Page - Freescale Semiconductor, Inc |
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MPC7441 Arkusz danych(HTML) 30 Page - Freescale Semiconductor, Inc |
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30 / 60 page ![]() MPC7448 RISC Microprocessor Hardware Specifications, Rev. 4 30 Freescale Semiconductor Package Description 8.2 Mechanical Dimensions for the MPC7448, 360 HCTE BGA Figure 13 provides the mechanical dimensions and bottom surface nomenclature for the MPC7448, 360 HCTE BGA package. Figure 13. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC7448, 360 HCTE BGA Package NOTES: 1. Dimensioning and tolerancing per ASME Y14.5M, 1994 2. Dimensions in millimeters. 3. Top side A1 corner index is a metalized feature with various shapes. Bottom side A1 corner is designated with a ball missing from the array. 0.2 C A 360X D 2X A1 CORNER E e 0.2 2X C B 123456789 10 111213141516 A B C D E F G H J K L M N P R T B 0.3 A 0.15 b A 0.15 A 171819 U W V Millimeters Dim Min Max A 2.32 2.80 A1 0.80 1.00 A2 0.70 0.90 A3 — 0.6 b 0.82 0.93 D 25.00 BSC D1 — 11.3 D2 8.0 — D3 — 6.5 D4 7.2 7.4 e 1.27 BSC E 25.00 BSC E1 — 11.3 E2 8.0 — E3 — 6.5 E4 7.9 8.1 Capacitor Region D3 E2 E1 A A1 A2 A3 E4 D4 E3 D1 D2 0.35 A |
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