MPC7441 datasheet(12/60 Pages) FREESCALE

12 / 60 page

MPC7448 RISC Microprocessor Hardware Specifications, Rev. 4

Freescale Semiconductor

Electrical and Thermal Characteristics

Table 5 provides the package thermal characteristics for the MPC7448. For more information regarding

thermal management, see Section 9.7, “Power and Thermal Management Information.”

Table 6 provides the DC electrical characteristics for the MPC7448.

Table 5. Package Thermal Characteristics1

Characteristic

Symbol

Value

Unit

Notes

Junction-to-ambient thermal resistance, natural convection, single-layer (1s) board

RθJA

•C/W

C/W

2, 3

Junction-to-ambient thermal resistance, natural convection, four-layer (2s2p) board

RθJMA

•C/W

C/W

2, 4

Junction-to-ambient thermal resistance, 200 ft/min airflow, single-layer (1s) board

RθJMA

•C/W

C/W

2, 4

Junction-to-ambient thermal resistance, 200 ft/min airflow, four-layer (2s2p) board

RθJMA

•C/W

C/W

2, 4

Junction-to-board thermal resistance

RθJB

•C/W

C/W

Junction-to-case thermal resistance

RθJC

< 0.1

•C/W

C/W

Notes:

1. Refer to Section 9.7, “Power and Thermal Management Information,” for details about thermal management.

2. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal

resistance.

3. Per JEDEC JESD51-2 with the single-layer board horizontal

4. Per JEDEC JESD51-6 with the board horizontal

5. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on

the top surface of the board near the package.

6. This is the thermal resistance between die and case top surface as measured by the cold plate method (MIL SPEC-883

Method 1012.1) with the calculated case temperature. The actual value of RθJC for the part is less than 0.1°C/W.

Table 6. DC Electrical Specifications

At recommended operating conditions. See Table 4.

Characteristic

Nominal Bus

Voltage 1

Symbol

Min

Max

Unit

Notes

Input high voltage

(all inputs)

1.5

VIH

OVDD × 0.65

OVDD + 0.3

1.8

OVDD × 0.65

OVDD + 0.3

2.5

1.7

OVDD + 0.3

Input low voltage

(all inputs)

1.5

VIL

–0.3

OVDD × 0.35

1.8

–0.3

OVDD × 0.35

2.5

–0.3

0.7

Input leakage current, all signals except

BVSEL0, LSSD_MODE, TCK, TDI, TMS,

TRST:

Vin = OVDD

Vin = GND

—Iin

—

– 50

µA

2, 3

Input leakage current, BVSEL0,

LSSD_MODE, TCK, TDI, TMS, TRST:

Vin = OVDD

Vin = GND

—Iin

—

– 2000

µA

2, 6

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