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15

14

13

12

11

5

4

3

2

1

C1P

PGND

C1N

NC

PVSS

INR

SDR

INL

NC

OUTR

NC − Nointernalconnection

DRV601

SLOS553 – JANUARY 2008

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

RTJ (QFN) PACKAGE

(TOP VIEW)

TERMINAL FUNCTIONS

TERMINAL

I/O

DESCRIPTION

NAME

QFN

C1P

1

I/O

Charge pump flying capacitor positive terminal

PGND

2

I

Power ground, connect to ground.

C1N

3

I/O

Charge pump flying capacitor negative terminal

NC

4, 6, 8, 12, 16, 20

No connection

PVSS

5

O

Output from charge pump.

SVSS

7

I

Amplifier negative supply, connect to PVSS via star connection.

OUTL

9

O

Left audio channel output signal

SVDD

10

I

Amplifier positive supply, connect to PVDD via star connection.

OUTR

11

O

Right audio channel output signal

INL

13

I

Left audio channel input signal

SDR

14

I

Right channel shutdown, active low logic.

INR

15

I

Right audio channel input signal

SGND

17

I

Signal ground, connect to ground.

SDL

18

I

Left channel shutdown, active low logic.

PVDD

19

I

Supply voltage, connect to positive supply.

Exposed Pad

Exposed pad must be soldered to a floating plane. Do NOT connect to power or ground.

2

Copyright © 2008, Texas Instruments Incorporated

Product Folder Link(s): DRV601