TDA7575BPD datasheet(29/32 Pages) STMICROELECTRONICS

29 / 32 page

TDA7575B

Package information

29/32

Package information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 39.

PowerSO36 (slug up) mechanical data and package dimensions

OUTLINE AND

MECHANICAL DATA

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

3.25

3.43

0.128

0.135

3.1

3.2

0.122

0.126

0.8

0.031

0.039

0.2

0.008

0.030

-0.040

0.0011

-0.0015

0.22

0.38

0.008

0.015

0.23

0.32

0.009

0.012

15.8

0.622

0.630

9.4

9.8

0.37

0.38

0.039

13.9

14.5

0.547

0.57

10.9

11.1

0.429

0.437

2.9

0.114

5.8

6.2

0.228

0.244

2.9

3.2

0.114

1.259

e0.65

0.026

11.05

0.435

0.075

0.003

15.5

15.9

0.61

0.625

1.1

0.043

0.8

1.1

0.031

0.043

10˚

s8 ˚8˚

(1) “D and E1” do not include mold flash or protusions.

Mold flash or protusions shall not exceed 0.15mm (0.006”)

(2) No intrusion allowed inwards the leads.

PowerSO36 (SLUG UP)

7183931 D

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