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TDA7495SA Arkusz danych(PDF) 12 Page - STMicroelectronics |
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TDA7495SA Arkusz danych(HTML) 12 Page - STMicroelectronics |
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12 / 15 page ![]() Clipwatt mounting suggestions TDA7495SA 12/15 5 Clipwatt mounting suggestions The suggested method for securing the Clipwatt package on an external heat sink is by a spring clip placed as close as possible to the center of the plastic body, as indicated in the example of Figure 26. Thermal grease can be used to further reduce the thermal resistance of the contact between package and heatsink. The clip should apply a force of 7 - 10 kg to provide sufficient pressure for a good contact. Care must be taken to ensure that the contact pressure on the package does not exceed 15 kg/mm². As an example, if the clip applies a 15-kg force on the package then the clip must have a contact area of at least 1 mm². Figure 26. Example of correctly placed clip |
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