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TDA7495SA Arkusz danych(PDF) 13 Page - STMicroelectronics |
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TDA7495SA Arkusz danych(HTML) 13 Page - STMicroelectronics |
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13 / 15 page ![]() TDA7495SA Package information 13/15 6 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. OUTLINE AND MECHANICAL DATA 0044538 G DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A3.2 0.126 B 1.05 0.041 C 0.15 0.006 D 1.50 0.061 E 0.49 0.55 0.019 0.022 F 0.67 0.73 0.026 0.029 G 1.14 1.27 1.4 0.045 0.050 0.055 G1 17.57 17.78 17.91 0.692 0.700 0.705 H1 12 0.480 H2 18.6 0.732 H3 19.85 0.781 L 17.9 0.704 L1 14.55 0.572 L2 10.7 11 11.2 0.421 0.433 0.441 L3 5.5 0.217 M 2.54 0.100 M1 2.54 0.100 Clipwatt15 Weight: 1.92gr Outline and mechanical data |
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