STA011 datasheet(36/38 Pages) STMICROELECTRONICS

36 / 38 page

Package information

STA011

36/38

Package information

In order to meet environmental requirements, ST (also) offers these devices in ECOPACK®

packages. ECOPACK® packages are lead-free. The category of second Level Interconnect

is marked on the package and on the inner box label, in compliance with JEDEC Standard

JESD97. The maximum ratings related to soldering conditions are also marked on the inner

box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 12.

TQFP44 mechanical data and package dimensions

OUTLINE AND

MECHANICAL DATA

DIM.

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

1.60

0.063

0.05

0.15

0.002

0.006

1.35

1.40

1.45

0.053

0.055

0.057

0.30

0.37

0.45

0.012

0.015

0.018

0.09

0.20

0.004

0.008

11.80

12.00

12.20

0.464

0.472

0.480

9.80

10.00

10.20

0.386

0.394

0.401

8.00

0.315

11.80

12.00

12.20

0.464

0.472

0.480

9.80

10.00

10.20

0.386

0.394

0.401

8.00

0.315

0.80

0.031

0.45

0.60

0.75

0.018

0.024

0.030

1.00

0.039

0˚(min.), 3.5˚(typ.), 7˚(max.)

TQFP44 (10 x 10 x 1.4mm)

Seating Plane

TQFP4410

0.10mm

.004

0076922 D

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