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Zakładka z wyszukiwarką danych komponentów |
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Zakładka z wyszukiwarką danych komponentów |
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MPC8640DEC Arkusz danych(PDF) 115 Page - Freescale Semiconductor, Inc |
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MPC8640DEC Arkusz danych(HTML) 115 Page - Freescale Semiconductor, Inc |
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115 / 140 page  MPC8640 and MPC8640D Integrated Host Processor Hardware Specifications, Rev. 1 Freescale Semiconductor 115 Thermal Tyco Electronics 800-522-6752 Chip Coolers™ P.O. Box 3668 Harrisburg, PA 17105-3668 Internet: www.chipcoolers.com Wakefield Engineering 603-635-5102 33 Bridge St. Pelham, NH 03076 Internet: www.wakefield.com Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost. 19.2.1 Internal Package Conduction Resistance For the exposed-die packaging technology described in Table 70, the intrinsic conduction thermal resistance paths are as follows: • The die junction-to-case thermal resistance (the case is actually the top of the exposed silicon die) • The die junction-to-board thermal resistance |
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