15

MUlTIPROTOCOl XFP OPTICAl TRANSCEIvER

—1310 NM FOR UP TO 10 KM REACH

Other information related to the 10 Gbps 1310 nm multiprotocol XFP optical

transceiver includes:

•Section4.1PackingandHandlingInstructions

•Section4.2ESDDischarge(ESD)

•Section4.3EyeSafety

4.1 Package and Handling Instructions

Connector covers

The 10 Gbps 1310 nm multiprotocol XFP optical transceiver is supplied with an

LC duplex receptacle. The connector plug supplied protects the connector dur-

ing standard manufacturing processes and handling by preventing contamination

from dust, aqueous solutions, body oils, or airborne particles.

Note: It is recommended that the connector plug remain on whenever the trans-

ceiver optical fiber connector is not inserted.

Recommended cleaning and degreasing chemicals

JDSU recommends the use of methyl, isopropyl and isobutyl alcohols for cleaning.

Do not use halogenated hydrocarbons (trichloroethane, ketones such as acetone,

chloroform, ethyl acetate, MEK, methylene chloride, methylene dichloride, phenol,

N-methylpyrolldone).

This product is not designed for aqueous wash.

Housing

The 10 Gbps 1310 nm multiprotocol XFP optical transceiver housing is made from

zinc.

4.2 ESD Discharge (ESD)

Handling

Normal ESD precautions are required during the handling of this module. This

transceiver is shipped in ESD protective packaging. It should be removed from

the packaging and otherwise handled in an ESD protected environment utilizing

standard grounded benches, floor mats, and wrist straps.

Test and operation

In most applications, the optical connector will protrude through the system chas-

sis and be subjected to the same ESD environment as the system. Once properly

installed in the system, this transceiver should meet and exceed common ESD test-

ing practices and fulfill system ESD requirements.

Typical of optical transceivers, this module’s receiver contains a highly sensitive

optical detector and amplifier which may become temporarily saturated during

an ESD strike. This could result in a short burst of bit errors. Such an event might

require that the application reacquire synchronization at the higher layers (serial-

izer/deserializer chip).

Section 4

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