TLE2227, TLE2227Y, TLE2237, TLE2237Y

EXCALIBUR LOW-NOISE HIGH-SPEED

PRECISION DUAL OPERATIONAL AMPLIFIERS

SLOS184 – FEBRUARY 1997

3

POST OFFICE BOX 655303

TLE2237Y chip information

ThIs chip, when properly assembled, displays characteristics similar to TLE2237. Thermal compression or

ultrasonic bonding may be used on the doped-aluminum bonding pads. The chip may be mounted with

conductive epoxy or a gold-silicon preform.

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 15 MILS TYPICAL

BONDING PADS: 4

× 4 MILS MINIMUM

TJmax = 150°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS.

+

–

1OUT

1IN +

1IN –

VCC +

(8)

(6)

(3)

(2)

(5)

(1)

–

+

(7)

2IN +

2IN –

2OUT

(4)

VCC –

116

104

(7)

(1)

(2)

(3)

(4)

(5)

(6)

(8)