SE97TP datasheet(45/55 Pages) NXP

Numer części	SE97TP

Szczegółowy opis	DDR memory module temp sensor with integrated SPD, 3.3 V

PDF	55 Pages

Scroll/Zoom	100%

Producent	NXP [NXP Semiconductors]

Strona internetowa	http://www.nxp.com

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45 / 55 page

SE97_7

Product data sheet

Rev. 07 — 29 January 2010

45 of 55

NXP Semiconductors

SE97

DDR memory module temp sensor with integrated SPD, 3.3 V

12. Package outline

Fig 41. Package outline SOT530-1 (TSSOP8)

UNIT

max.

D(1)

E(2)

Z(1)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

0.15

0.05

0.95

0.85

0.30

0.19

0.20

0.13

3.1

2.9

4.5

4.3

0.65

6.5

6.3

0.70

0.35

0.1

0.94

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

0.7

0.5

SOT530-1

MO-153

00-02-24

03-02-18

w M

0.25

(A3)

detail X

v M A

2.5

5 mm

scale

TSSOP8: plastic thin shrink small outline package; 8 leads; body width 4.4 mm

SOT530-1

1.1

pin 1 index

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