SE97TP datasheet(49/55 Pages) NXP

Numer części	SE97TP

Szczegółowy opis	DDR memory module temp sensor with integrated SPD, 3.3 V

PDF	55 Pages

Scroll/Zoom	100%

Producent	NXP [NXP Semiconductors]

Strona internetowa	http://www.nxp.com

Logo

49 / 55 page

SE97_7

Product data sheet

Rev. 07 — 29 January 2010

49 of 55

NXP Semiconductors

SE97

DDR memory module temp sensor with integrated SPD, 3.3 V

Fig 45. Package outline SOT1069-2 (HWSON8)

References

Outline

version

European

projection

Issue date

IEC

JEDEC

JEITA

SOT1069-2

- - -

MO-229

- - -

sot1069-2_po

09-10-22

09-11-18

Unit

max

nom

min

0.80

0.75

0.70

0.05

0.02

0.00

2.1

2.0

1.9

1.6

1.5

1.4

3.1

3.0

2.9

0.5

1.5

0.45

0.40

0.35

0.05

A(1)

Dimensions

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

HWSON8: plastic thermal enhanced very very thin small outline package; no leads;

8 terminals; body 2 x 3 x 0.8 mm

SOT1069-2

0.65

0.55

0.45

0.2

0.30

0.25

0.18

D(1)

E(1)

1.6

1.5

1.4

ee1

0.40

0.35

0.30

0.1

0.05

2 mm

scale

terminal 1

index area

detail X

terminal 1

index area

SE97TP Arkusz danych(PDF) 49 Page - NXP Semiconductors

SE97TP Arkusz danych(HTML) 49 Page - NXP Semiconductors

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55

Arkusz danych Pobierz

Link URL