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MCP1825-0802E/EB Arkusz danych(PDF) 22 Page - Microchip Technology |
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MCP1825-0802E/EB Arkusz danych(HTML) 22 Page - Microchip Technology |
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22 / 38 page ![]() MCP1825/MCP1825S DS22056B-page 22 © 2008 Microchip Technology Inc. 5.3.1.2 Junction Temperature Estimate To estimate the internal junction temperature, the calculated temperature rise is added to the ambient or offset temperature. For this example, the worst-case junction temperature is estimated below: 5.3.1.3 Maximum Package Power Dissipation at 60°C Ambient Temperature From this table, you can see the difference in maximum allowable power dissipation between the TO-220-5 package and the DDPAK-5 package. TJ =TJRISE + TA(MAX) TJ = 15.06°C + 60.0°C TJ = 75.06°C TO-220-5 (29.3°C/W R θJA): PD(MAX) = (125°C – 60°C) / 29.3°C/W PD(MAX) = 2.218W DDPAK-5 (31.2°C/Watt R θJA): PD(MAX) = (125°C – 60°C)/ 31.2°C/W PD(MAX) = 2.083W |
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