MCP1825/MCP1825S

DS22056B-page 26

© 2008 Microchip Technology Inc.

3-Lead Plastic Small Outline Transistor (DB) [SOT-223]

Notes:

1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side.

2. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

Number of Leads

N

3

Lead Pitch

e

2.30 BSC

Outside Lead Pitch

e1

4.60 BSC

Overall Height

A

–

–

1.80

Standoff

A1

0.02

–

0.10

Molded Package Height

A2

1.50

1.60

1.70

Overall Width

E

6.70

7.00

7.30

Molded Package Width

E1

3.30

3.50

3.70

Overall Length

D

6.30

6.50

6.70

Lead Thickness

c

0.23

0.30

0.35

Lead Width

b

0.60

0.76

0.84

Tab Lead Width

b2

2.90

3.00

3.10

Foot Length

L

0.75

–

–

Lead Angle

φ

0°

–

10°

D

b2

E

E1

1

2

3

e

e1

A

A2

A1

b

c

L

φ

Microchip Technology Drawing C04-032B