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5000 Arkusz danych(PDF) 90 Page - Intel Corporation |
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5000 Arkusz danych(HTML) 90 Page - Intel Corporation |
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90 / 104 page ![]() Boxed Processor Specifications 90 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet Notes: 1. The heat sinks represented in these images are for reference only, and may not represent the final boxed processor heat sinks. 2. The screws, springs, and standoffs will be captive to the heat sink. This image shows all of the components in an exploded view. 3. It is intended that the CEK spring will ship with the base board and be pre-attached prior to shipping. 8.2 Mechanical Specifications This section documents the mechanical specifications of the boxed processor. Figure 8-2. Boxed Dual-Core Intel Xeon Processor 5000 Series 2U Passive Heat Sink Figure 8-3. 2U Passive Dual-Core Intel Xeon Processor 5000 Series Thermal Solution (Exploded View) Heat sink Heat sink standoffs Heat sink screw springs Thermal Interface Material Heat sink screws Motherboard and processor Chassis pan Protective Tape CEK spring Heat sink Heat sink standoffs Heat sink screw springs Thermal Interface Material Heat sink screws Motherboard and processor Chassis pan Protective Tape CEK spring |
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